Features
- 6th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Skylake-U)
- 2 DDR4-2133 SO-DIMM, up to 32GB
- Max. up to 6 lanes of PCI Express
- 3 SATA-600
- 4 USB 3.0 and 8 USB 2.0
- AXView 2.0 intelligent remote management software
- TPM 1.2 supported
Introduction
The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
