Features
- Dual 3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
- 16 288-pin DDR4-3200 RDIMM for up to 1TB of memory
- 4 PCIe x16 and 2 PCIe x8
- Supports 2 M.2 Key M slots for NVMe with RAID 0 & 1
- Supports TPM 2.0 module (optional)
- Two 10GbE ports
- IPMI (optional)
Introduction
The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
