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CEM330

Status : Available

COM Express Type 10 Mini Module with Intel Atom® X7000 or Intel® Core™ i3/N-series Processors

Datasheet
Datasheet (PDF)
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CEM330
CEM330
CEM330
Dual-View

Dual-View

Fanless

Fanless

Solid CAP

Solid CAP

USB 3.2

USB 3.2

Wide Temperature

Wide Temperature

  • Features
  • Specifications
  • Ordering Information
  • Download
  • FAQ

Features

  • Intel Atom® X7000 or Intel® Core™ i3/N-series processors (Amston Lake/Alder Lake-N)
  • Up to 16GB LPDDR5 memory onboard
  • Supports up to 4 PCI Express lanes
  • Up to 2 SATA 3.0
  • 2 USB 3.2 and 8 USB 2.0
  • eMMC and TPM 2.0 onboard

Specifications

CPU
  • Intel Atom® X7000 or Intel® Core™ i3 N-series processors
Chipset
  • SoC integrated
System Memory
  • LPDDR5-4800, up to 16GB
BIOS
  • AMI
Serial
  • 1 x LPC
  • 1 x SPI
  • 2 x TX/RX
USB
  • 2 x USB 3.2 Gen 2
  • 8 x USB 2.0
Ethernet
  • 1 x 10/100/1000/2500 Mbps Ethernet (Intel® I226LM)
Display
  • 1 x LVDS; 18/24-bit single channel (optional eDP 1.4b)
  • 1 x DDI (with up to 4K supported)
GPIO
  • 4-CH in/4-CH out
Audio
  • HD link interface to the baseboard for Codec
Storage
  • 32GB/64GB eMMC onboard
  • 2 x SATA 3.0 (optional)
Expansion
  • Up to 4 x PCle x1
Others
  • TPM 2.0
  • 1 x I2C
Battery
  • Smart Battery
Power Input
  • ATX: +12V, +5VSB
  • AT: +12V
  • Extended voltage: +4.75V to +20V
Watchdog Timer
  • 65536 levels, 0 to 65535 sec.
Hardware Monitoring
  • Yes
Operating Temperature
  • Extended temp SKU: -40°C to +85°C (-40°F to +185°F), operation with a system thermal solution
  • Standard temp SKU: -20°C to +70°C (-4°F to +158°F) with standard thermal solution
Vibration
  • 3.5 Grms
Relative Humidity
  • 10% to 95% relative humidity, non-condensing
Dimensions
  • 84 x 55 mm
Board Thickness
  • 2.0 mm
Certifications
  • CE

Ordering Information

  • CEM330 X7433RE-4G/32G (P/N-E38D330105)
    COM Express Type 10 Mini module with Intel Atom® X7433RE, LPDDR5 4GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature)
  • CEM330 X7835RE-16G/64G
    COM Express Type 10 Mini module with Intel Atom® X7835RE, LPDDR5 16GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature)
  • CEM330 X7433RE-8G/64G
    COM Express Type 10 Mini module with Intel Atom® X7433RE, LPDDR5 8GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature)
  • CEM330 X7211RE-8G/32G
    COM Express Type 10 Mini module with Intel Atom® X7211RE, LPDDR5 8GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature)
  • CEM330 X7425E-16G/64G
    COM Express Type 10 Mini module with Intel Atom® X7425E, LPDDR5 16GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (commercial temperature)
  • CEM330 X7213E-8G/32G
    COM Express Type 10 Mini module with Intel Atom® X7213E, LPDDR5 8GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (commercial temperature)
  • CEB94017 (P/N-E394017101)
    COM Express Type 10 development baseboard
  • 712000012700
    CEM330 heatspreader
  • 5078D840200E
    Active cooler with fan (should be assembled with heat spreader)

Download

Drivers

Date Description Version Download File
2026/01/30 5.Serial IO VA1
2026/01/30 4.LAN VA1
2026/01/30 3.ME VA1
2026/01/30 2.Graphics VA1
2026/01/30 1.Chipset VA1

Software

Manual

Date Description Version Download File
2026/01/30 CEM330 User's Manual VA1_1-12-2026 VA1

Design Guide

Technical Announcement

Certificates

Frequently Asked Questions

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